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C82700 Copper vs. Solder Alloy 171

C82700 copper belongs to the copper alloys classification, while solder alloy 171 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C82700 copper and the bottom bar is solder alloy 171.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 1.8
45
Poisson's Ratio 0.33
0.39
Shear Modulus, GPa 46
14
Tensile Strength: Ultimate (UTS), MPa 1200
48

Thermal Properties

Latent Heat of Fusion, J/g 240
47
Melting Completion (Liquidus), °C 950
180
Melting Onset (Solidus), °C 860
180
Specific Heat Capacity, J/kg-K 380
190
Thermal Conductivity, W/m-K 130
50
Thermal Expansion, µm/m-K 17
24

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
12
Electrical Conductivity: Equal Weight (Specific), % IACS 21
12

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.8
Embodied Carbon, kg CO2/kg material 12
13
Embodied Energy, MJ/kg 180
210

Common Calculations

Stiffness to Weight: Axial, points 7.8
2.4
Stiffness to Weight: Bending, points 19
13
Strength to Weight: Axial, points 38
1.5
Strength to Weight: Bending, points 29
3.3
Thermal Diffusivity, mm2/s 39
30
Thermal Shock Resistance, points 41
3.7

Alloy Composition

Aluminum (Al), % 0 to 0.15
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 2.4 to 2.6
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0 to 0.090
0
Copper (Cu), % 94.6 to 96.7
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.020
34.7 to 36.7
Nickel (Ni), % 1.0 to 1.5
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
1.8 to 2.2
Tin (Sn), % 0 to 0.1
61.5 to 62.5
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0