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C82700 Copper vs. Solder Alloy 703

C82700 copper belongs to the copper alloys classification, while solder alloy 703 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C82700 copper and the bottom bar is solder alloy 703.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
51
Elongation at Break, % 1.8
35
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 46
19
Tensile Strength: Ultimate (UTS), MPa 1200
57

Thermal Properties

Latent Heat of Fusion, J/g 240
61
Melting Completion (Liquidus), °C 950
220
Melting Onset (Solidus), °C 860
220
Specific Heat Capacity, J/kg-K 380
220
Thermal Conductivity, W/m-K 130
55
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
14
Electrical Conductivity: Equal Weight (Specific), % IACS 21
17

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.4
Embodied Carbon, kg CO2/kg material 12
18
Embodied Energy, MJ/kg 180
300

Common Calculations

Stiffness to Weight: Axial, points 7.8
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 38
2.1
Strength to Weight: Bending, points 29
4.4
Thermal Diffusivity, mm2/s 39
33
Thermal Shock Resistance, points 41
3.7

Alloy Composition

Aluminum (Al), % 0 to 0.15
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 2.4 to 2.6
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0 to 0.090
0
Copper (Cu), % 94.6 to 96.7
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 1.0 to 1.5
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
3.3 to 3.7
Tin (Sn), % 0 to 0.1
95.8 to 96.7
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0