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C82800 Copper vs. C19800 Copper

Both C82800 copper and C19800 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C82800 copper and the bottom bar is C19800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 1.0 to 20
9.0 to 12
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 46
43
Tensile Strength: Ultimate (UTS), MPa 670 to 1140
430 to 550
Tensile Strength: Yield (Proof), MPa 380 to 1000
420 to 550

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 310
200
Melting Completion (Liquidus), °C 930
1070
Melting Onset (Solidus), °C 890
1050
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
260
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
61
Electrical Conductivity: Equal Weight (Specific), % IACS 19
62

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 12
2.8
Embodied Energy, MJ/kg 190
43
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 110
49 to 52
Resilience: Unit (Modulus of Resilience), kJ/m3 590 to 4080
770 to 1320
Stiffness to Weight: Axial, points 7.8
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 21 to 36
14 to 17
Strength to Weight: Bending, points 20 to 28
14 to 17
Thermal Diffusivity, mm2/s 36
75
Thermal Shock Resistance, points 23 to 39
15 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.15
0
Beryllium (Be), % 2.5 to 2.9
0
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 94.6 to 97.2
95.7 to 99.47
Iron (Fe), % 0 to 0.25
0.020 to 0.5
Lead (Pb), % 0 to 0.020
0
Magnesium (Mg), % 0
0.1 to 1.0
Nickel (Ni), % 0 to 0.2
0
Phosphorus (P), % 0
0.010 to 0.1
Silicon (Si), % 0.2 to 0.35
0
Tin (Sn), % 0 to 0.1
0.1 to 1.0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0.3 to 1.5
Residuals, % 0
0 to 0.2