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C82800 Copper vs. C26000 Brass

Both C82800 copper and C26000 brass are copper alloys. They have 70% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C82800 copper and the bottom bar is C26000 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 1.0 to 20
2.5 to 66
Poisson's Ratio 0.33
0.31
Rockwell B Hardness 45 to 85
53 to 93
Shear Modulus, GPa 46
41
Tensile Strength: Ultimate (UTS), MPa 670 to 1140
320 to 680
Tensile Strength: Yield (Proof), MPa 380 to 1000
110 to 570

Thermal Properties

Latent Heat of Fusion, J/g 240
180
Maximum Temperature: Mechanical, °C 310
140
Melting Completion (Liquidus), °C 930
950
Melting Onset (Solidus), °C 890
920
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
120
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
28
Electrical Conductivity: Equal Weight (Specific), % IACS 19
31

Otherwise Unclassified Properties

Density, g/cm3 8.7
8.2
Embodied Carbon, kg CO2/kg material 12
2.7
Embodied Energy, MJ/kg 190
45
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 110
6.1 to 420
Resilience: Unit (Modulus of Resilience), kJ/m3 590 to 4080
51 to 1490
Stiffness to Weight: Axial, points 7.8
7.2
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 21 to 36
11 to 23
Strength to Weight: Bending, points 20 to 28
13 to 21
Thermal Diffusivity, mm2/s 36
38
Thermal Shock Resistance, points 23 to 39
11 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.15
0
Beryllium (Be), % 2.5 to 2.9
0
Bismuth (Bi), % 0
0 to 0.0059
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 94.6 to 97.2
68.5 to 71.5
Iron (Fe), % 0 to 0.25
0 to 0.050
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 0 to 0.2
0
Silicon (Si), % 0.2 to 0.35
0
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
28.1 to 31.5
Residuals, % 0
0 to 0.3