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C84500 Brass vs. Solder Alloy 201

C84500 brass belongs to the copper alloys classification, while solder alloy 201 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C84500 brass and the bottom bar is solder alloy 201.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 55
13
Elastic (Young's, Tensile) Modulus, GPa 100
50
Elongation at Break, % 28
38
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 39
19
Tensile Strength: Ultimate (UTS), MPa 240
41

Thermal Properties

Latent Heat of Fusion, J/g 180
64
Melting Completion (Liquidus), °C 980
240
Melting Onset (Solidus), °C 840
240
Specific Heat Capacity, J/kg-K 360
220
Thermal Conductivity, W/m-K 72
28
Thermal Expansion, µm/m-K 19
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 16
12
Electrical Conductivity: Equal Weight (Specific), % IACS 17
15

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.3
Embodied Carbon, kg CO2/kg material 2.9
15
Embodied Energy, MJ/kg 47
250
Embodied Water, L/kg 340
1320

Common Calculations

Stiffness to Weight: Axial, points 6.6
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 7.7
1.6
Strength to Weight: Bending, points 9.8
3.6
Thermal Diffusivity, mm2/s 23
17
Thermal Shock Resistance, points 8.6
2.7

Alloy Composition

Aluminum (Al), % 0 to 0.0050
0 to 0.0010
Antimony (Sb), % 0 to 0.25
4.5 to 5.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 77 to 79
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 6.0 to 7.5
0 to 0.070
Nickel (Ni), % 0 to 1.0
0 to 0.010
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.0050
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.080
0
Tin (Sn), % 2.0 to 4.0
94 to 95.5
Zinc (Zn), % 10 to 14
0 to 0.0010
Residuals, % 0 to 0.7
0