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C85200 Brass vs. CC380H Copper-nickel

Both C85200 brass and CC380H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 73% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C85200 brass and the bottom bar is CC380H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 28
26
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 40
47
Tensile Strength: Ultimate (UTS), MPa 270
310
Tensile Strength: Yield (Proof), MPa 95
120

Thermal Properties

Latent Heat of Fusion, J/g 180
220
Maximum Temperature: Mechanical, °C 140
220
Melting Completion (Liquidus), °C 940
1130
Melting Onset (Solidus), °C 930
1080
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 84
46
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
11
Electrical Conductivity: Equal Weight (Specific), % IACS 19
11

Otherwise Unclassified Properties

Base Metal Price, % relative 26
36
Density, g/cm3 8.4
8.9
Embodied Carbon, kg CO2/kg material 2.8
3.8
Embodied Energy, MJ/kg 46
58
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
65
Resilience: Unit (Modulus of Resilience), kJ/m3 42
59
Stiffness to Weight: Axial, points 7.0
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 8.9
9.8
Strength to Weight: Bending, points 11
12
Thermal Diffusivity, mm2/s 27
13
Thermal Shock Resistance, points 9.3
11

Alloy Composition

Aluminum (Al), % 0 to 0.0050
0 to 0.010
Antimony (Sb), % 0 to 0.2
0
Copper (Cu), % 70 to 74
84.5 to 89
Iron (Fe), % 0 to 0.6
1.0 to 1.8
Lead (Pb), % 1.5 to 3.8
0 to 0.030
Manganese (Mn), % 0
1.0 to 1.5
Nickel (Ni), % 0 to 1.0
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.050
0 to 0.1
Sulfur (S), % 0 to 0.050
0
Tin (Sn), % 0.7 to 2.0
0
Zinc (Zn), % 20 to 27
0 to 0.5
Residuals, % 0 to 0.9
0