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C85400 Brass vs. CC382H Copper-nickel

Both C85400 brass and CC382H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common.

For each property being compared, the top bar is C85400 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 55
130
Elastic (Young's, Tensile) Modulus, GPa 100
140
Elongation at Break, % 23
20
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 40
53
Tensile Strength: Ultimate (UTS), MPa 220
490
Tensile Strength: Yield (Proof), MPa 85
290

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 130
260
Melting Completion (Liquidus), °C 940
1180
Melting Onset (Solidus), °C 940
1120
Specific Heat Capacity, J/kg-K 380
410
Thermal Conductivity, W/m-K 89
30
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 22
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 25
41
Density, g/cm3 8.3
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.2
Embodied Energy, MJ/kg 46
76
Embodied Water, L/kg 330
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40
85
Resilience: Unit (Modulus of Resilience), kJ/m3 35
290
Stiffness to Weight: Axial, points 7.0
8.8
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 7.5
15
Strength to Weight: Bending, points 9.9
16
Thermal Diffusivity, mm2/s 28
8.2
Thermal Shock Resistance, points 7.6
16

Alloy Composition

Aluminum (Al), % 0 to 0.35
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 65 to 70
62.8 to 68.4
Iron (Fe), % 0 to 0.7
0.5 to 1.0
Lead (Pb), % 1.5 to 3.8
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0 to 1.0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0 to 0.050
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Tin (Sn), % 0.5 to 1.5
0
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 24 to 32
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 1.1
0