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C85800 Brass vs. CC380H Copper-nickel

Both C85800 brass and CC380H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 64% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C85800 brass and the bottom bar is CC380H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 15
26
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
47
Tensile Strength: Ultimate (UTS), MPa 380
310
Tensile Strength: Yield (Proof), MPa 210
120

Thermal Properties

Latent Heat of Fusion, J/g 170
220
Maximum Temperature: Mechanical, °C 120
220
Melting Completion (Liquidus), °C 900
1130
Melting Onset (Solidus), °C 870
1080
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 84
46
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
11
Electrical Conductivity: Equal Weight (Specific), % IACS 22
11

Otherwise Unclassified Properties

Base Metal Price, % relative 24
36
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 2.8
3.8
Embodied Energy, MJ/kg 47
58
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 48
65
Resilience: Unit (Modulus of Resilience), kJ/m3 210
59
Stiffness to Weight: Axial, points 7.2
7.8
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 13
9.8
Strength to Weight: Bending, points 15
12
Thermal Diffusivity, mm2/s 27
13
Thermal Shock Resistance, points 13
11

Alloy Composition

Aluminum (Al), % 0 to 0.55
0 to 0.010
Antimony (Sb), % 0 to 0.050
0
Arsenic (As), % 0 to 0.050
0
Copper (Cu), % 57 to 69
84.5 to 89
Iron (Fe), % 0 to 0.5
1.0 to 1.8
Lead (Pb), % 0 to 1.5
0 to 0.030
Manganese (Mn), % 0 to 0.25
1.0 to 1.5
Nickel (Ni), % 0 to 0.5
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0 to 0.010
0
Silicon (Si), % 0 to 0.25
0 to 0.1
Sulfur (S), % 0 to 0.050
0
Tin (Sn), % 0 to 1.5
0
Zinc (Zn), % 31 to 41
0 to 0.5
Residuals, % 0 to 1.3
0