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C85900 Brass vs. C12900 Copper

Both C85900 brass and C12900 copper are copper alloys. They have 60% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C85900 brass and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 30
2.8 to 50
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 40
43
Tensile Strength: Ultimate (UTS), MPa 460
220 to 420
Tensile Strength: Yield (Proof), MPa 190
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 170
210
Maximum Temperature: Mechanical, °C 130
200
Melting Completion (Liquidus), °C 830
1080
Melting Onset (Solidus), °C 790
1030
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 89
380
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 25
98
Electrical Conductivity: Equal Weight (Specific), % IACS 28
98

Otherwise Unclassified Properties

Base Metal Price, % relative 24
32
Density, g/cm3 8.0
9.0
Embodied Carbon, kg CO2/kg material 2.9
2.6
Embodied Energy, MJ/kg 49
41
Embodied Water, L/kg 330
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 170
24 to 640
Stiffness to Weight: Axial, points 7.3
7.2
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 16
6.8 to 13
Strength to Weight: Bending, points 17
9.1 to 14
Thermal Diffusivity, mm2/s 29
110
Thermal Shock Resistance, points 16
7.8 to 15

Alloy Composition

Aluminum (Al), % 0.1 to 0.6
0
Antimony (Sb), % 0 to 0.2
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Boron (B), % 0 to 0.2
0
Copper (Cu), % 58 to 62
99.88 to 100
Iron (Fe), % 0 to 0.5
0
Lead (Pb), % 0 to 0.090
0 to 0.0040
Manganese (Mn), % 0 to 0.010
0
Nickel (Ni), % 0 to 1.5
0 to 0.050
Phosphorus (P), % 0 to 0.010
0
Silicon (Si), % 0 to 0.25
0
Silver (Ag), % 0
0 to 0.054
Sulfur (S), % 0.1 to 0.65
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 0 to 1.5
0
Zinc (Zn), % 31 to 41
0
Zirconium (Zr), % 0 to 0.2
0
Residuals, % 0 to 0.7
0