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C87900 Brass vs. C97800 Nickel Silver

Both C87900 brass and C97800 nickel silver are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C87900 brass and the bottom bar is C97800 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
130
Elongation at Break, % 25
10
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 41
48
Tensile Strength: Ultimate (UTS), MPa 480
370
Tensile Strength: Yield (Proof), MPa 240
170

Thermal Properties

Latent Heat of Fusion, J/g 190
220
Maximum Temperature: Mechanical, °C 130
230
Melting Completion (Liquidus), °C 930
1180
Melting Onset (Solidus), °C 900
1140
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
25
Thermal Expansion, µm/m-K 20
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
4.0
Electrical Conductivity: Equal Weight (Specific), % IACS 17
4.1

Otherwise Unclassified Properties

Base Metal Price, % relative 24
40
Density, g/cm3 8.1
8.8
Embodied Carbon, kg CO2/kg material 2.7
5.1
Embodied Energy, MJ/kg 46
76
Embodied Water, L/kg 320
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
31
Resilience: Unit (Modulus of Resilience), kJ/m3 270
120
Stiffness to Weight: Axial, points 7.3
8.1
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 17
12
Strength to Weight: Bending, points 17
13
Thermal Diffusivity, mm2/s 37
7.3
Thermal Shock Resistance, points 16
13

Alloy Composition

Aluminum (Al), % 0 to 0.15
0 to 0.0050
Antimony (Sb), % 0 to 0.050
0 to 0.2
Arsenic (As), % 0 to 0.050
0
Copper (Cu), % 63 to 69.2
64 to 67
Iron (Fe), % 0 to 0.4
0 to 1.5
Lead (Pb), % 0 to 0.25
1.0 to 2.5
Manganese (Mn), % 0 to 0.15
0
Nickel (Ni), % 0 to 0.5
24 to 27
Phosphorus (P), % 0 to 0.010
0 to 0.050
Silicon (Si), % 0.8 to 1.2
0 to 0.15
Sulfur (S), % 0 to 0.050
0 to 0.080
Tin (Sn), % 0 to 0.25
4.0 to 5.5
Zinc (Zn), % 30 to 36
1.0 to 4.0
Residuals, % 0
0 to 0.4