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C90500 Gun Metal vs. CC381H Copper-nickel

Both C90500 gun metal and CC381H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 68% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C90500 gun metal and the bottom bar is CC381H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 20
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 40
52
Tensile Strength: Ultimate (UTS), MPa 320
380
Tensile Strength: Yield (Proof), MPa 160
140

Thermal Properties

Latent Heat of Fusion, J/g 190
240
Maximum Temperature: Mechanical, °C 170
260
Melting Completion (Liquidus), °C 1000
1180
Melting Onset (Solidus), °C 850
1120
Specific Heat Capacity, J/kg-K 370
410
Thermal Conductivity, W/m-K 75
30
Thermal Expansion, µm/m-K 18
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
6.8
Electrical Conductivity: Equal Weight (Specific), % IACS 11
6.9

Otherwise Unclassified Properties

Base Metal Price, % relative 35
40
Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 3.6
5.0
Embodied Energy, MJ/kg 59
73
Embodied Water, L/kg 390
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 54
60
Resilience: Unit (Modulus of Resilience), kJ/m3 110
68
Stiffness to Weight: Axial, points 6.9
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 10
12
Strength to Weight: Bending, points 12
13
Thermal Diffusivity, mm2/s 23
8.4
Thermal Shock Resistance, points 12
13

Alloy Composition

Aluminum (Al), % 0 to 0.0050
0 to 0.010
Antimony (Sb), % 0 to 0.2
0
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 86 to 89
64.5 to 69.9
Iron (Fe), % 0 to 0.2
0.5 to 1.5
Lead (Pb), % 0 to 0.3
0 to 0.030
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 1.0
29 to 31
Phosphorus (P), % 0 to 1.5
0 to 0.010
Silicon (Si), % 0 to 0.0050
0 to 0.1
Sulfur (S), % 0 to 0.050
0 to 0.010
Tin (Sn), % 9.0 to 11
0
Zinc (Zn), % 1.0 to 3.0
0 to 0.5
Residuals, % 0 to 0.3
0