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C96200 Copper-nickel vs. EN 1.6579 Steel

C96200 copper-nickel belongs to the copper alloys classification, while EN 1.6579 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C96200 copper-nickel and the bottom bar is EN 1.6579 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 23
11 to 14
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 46
73
Tensile Strength: Ultimate (UTS), MPa 350
850 to 980
Tensile Strength: Yield (Proof), MPa 190
600 to 910

Thermal Properties

Latent Heat of Fusion, J/g 220
250
Maximum Temperature: Mechanical, °C 220
440
Melting Completion (Liquidus), °C 1150
1460
Melting Onset (Solidus), °C 1100
1410
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 45
39
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
7.7
Electrical Conductivity: Equal Weight (Specific), % IACS 11
8.8

Otherwise Unclassified Properties

Base Metal Price, % relative 36
3.7
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 3.8
1.7
Embodied Energy, MJ/kg 58
22
Embodied Water, L/kg 300
56

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 68
100 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 150
950 to 2210
Stiffness to Weight: Axial, points 7.8
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 11
30 to 35
Strength to Weight: Bending, points 13
25 to 28
Thermal Diffusivity, mm2/s 13
11
Thermal Shock Resistance, points 12
25 to 29

Alloy Composition

Carbon (C), % 0 to 0.1
0.32 to 0.38
Chromium (Cr), % 0
1.4 to 1.7
Copper (Cu), % 83.6 to 90
0
Iron (Fe), % 1.0 to 1.8
94.2 to 96.1
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0 to 1.5
0.6 to 1.0
Molybdenum (Mo), % 0
0.15 to 0.35
Nickel (Ni), % 9.0 to 11
1.4 to 1.7
Niobium (Nb), % 0 to 1.0
0
Phosphorus (P), % 0 to 0.020
0 to 0.025
Silicon (Si), % 0 to 0.5
0 to 0.6
Sulfur (S), % 0 to 0.020
0 to 0.030
Residuals, % 0 to 0.5
0