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C96200 Copper-nickel vs. S32760 Stainless Steel

C96200 copper-nickel belongs to the copper alloys classification, while S32760 stainless steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C96200 copper-nickel and the bottom bar is S32760 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 23
28
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 46
80
Tensile Strength: Ultimate (UTS), MPa 350
850
Tensile Strength: Yield (Proof), MPa 190
620

Thermal Properties

Latent Heat of Fusion, J/g 220
300
Maximum Temperature: Mechanical, °C 220
1100
Melting Completion (Liquidus), °C 1150
1460
Melting Onset (Solidus), °C 1100
1410
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 45
15
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 11
2.5

Otherwise Unclassified Properties

Base Metal Price, % relative 36
22
Density, g/cm3 8.9
7.9
Embodied Carbon, kg CO2/kg material 3.8
4.1
Embodied Energy, MJ/kg 58
57
Embodied Water, L/kg 300
180

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 68
220
Resilience: Unit (Modulus of Resilience), kJ/m3 150
930
Stiffness to Weight: Axial, points 7.8
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 11
30
Strength to Weight: Bending, points 13
25
Thermal Diffusivity, mm2/s 13
4.0
Thermal Shock Resistance, points 12
23

Alloy Composition

Carbon (C), % 0 to 0.1
0 to 0.030
Chromium (Cr), % 0
24 to 26
Copper (Cu), % 83.6 to 90
0.5 to 1.0
Iron (Fe), % 1.0 to 1.8
57.6 to 65.8
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0 to 1.5
0 to 1.0
Molybdenum (Mo), % 0
3.0 to 4.0
Nickel (Ni), % 9.0 to 11
6.0 to 8.0
Niobium (Nb), % 0 to 1.0
0
Nitrogen (N), % 0
0.2 to 0.3
Phosphorus (P), % 0 to 0.020
0 to 0.030
Silicon (Si), % 0 to 0.5
0 to 1.0
Sulfur (S), % 0 to 0.020
0 to 0.010
Tungsten (W), % 0
0.5 to 1.0
Residuals, % 0 to 0.5
0