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C96300 Copper-nickel vs. AISI 329 Stainless Steel

C96300 copper-nickel belongs to the copper alloys classification, while AISI 329 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is AISI 329 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
240
Elastic (Young's, Tensile) Modulus, GPa 130
200
Elongation at Break, % 11
17
Poisson's Ratio 0.33
0.27
Shear Modulus, GPa 49
80
Tensile Strength: Ultimate (UTS), MPa 580
710
Tensile Strength: Yield (Proof), MPa 430
540

Thermal Properties

Latent Heat of Fusion, J/g 230
300
Maximum Temperature: Mechanical, °C 240
1100
Melting Completion (Liquidus), °C 1200
1440
Melting Onset (Solidus), °C 1150
1390
Specific Heat Capacity, J/kg-K 400
480
Thermal Conductivity, W/m-K 37
16
Thermal Expansion, µm/m-K 16
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
2.0
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
2.4

Otherwise Unclassified Properties

Base Metal Price, % relative 42
16
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 5.1
3.1
Embodied Energy, MJ/kg 76
44
Embodied Water, L/kg 290
170

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
110
Resilience: Unit (Modulus of Resilience), kJ/m3 720
730
Stiffness to Weight: Axial, points 8.2
15
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 18
25
Strength to Weight: Bending, points 17
23
Thermal Diffusivity, mm2/s 10
4.3
Thermal Shock Resistance, points 20
19

Alloy Composition

Carbon (C), % 0 to 0.15
0 to 0.080
Chromium (Cr), % 0
23 to 28
Copper (Cu), % 72.3 to 80.8
0
Iron (Fe), % 0.5 to 1.5
63.1 to 74
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0 to 1.0
Molybdenum (Mo), % 0
1.0 to 2.0
Nickel (Ni), % 18 to 22
2.0 to 5.0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.040
Silicon (Si), % 0 to 0.5
0 to 0.75
Sulfur (S), % 0 to 0.020
0 to 0.030
Residuals, % 0 to 0.5
0