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C96300 Copper-nickel vs. ASTM A369 Grade FP11

C96300 copper-nickel belongs to the copper alloys classification, while ASTM A369 grade FP11 belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is ASTM A369 grade FP11.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
140
Elastic (Young's, Tensile) Modulus, GPa 130
190
Elongation at Break, % 11
20
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 49
73
Tensile Strength: Ultimate (UTS), MPa 580
470
Tensile Strength: Yield (Proof), MPa 430
240

Thermal Properties

Latent Heat of Fusion, J/g 230
260
Maximum Temperature: Mechanical, °C 240
430
Melting Completion (Liquidus), °C 1200
1460
Melting Onset (Solidus), °C 1150
1420
Specific Heat Capacity, J/kg-K 400
470
Thermal Conductivity, W/m-K 37
40
Thermal Expansion, µm/m-K 16
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
7.4
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
8.5

Otherwise Unclassified Properties

Base Metal Price, % relative 42
2.9
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 5.1
1.6
Embodied Energy, MJ/kg 76
21
Embodied Water, L/kg 290
52

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
80
Resilience: Unit (Modulus of Resilience), kJ/m3 720
150
Stiffness to Weight: Axial, points 8.2
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 18
17
Strength to Weight: Bending, points 17
17
Thermal Diffusivity, mm2/s 10
11
Thermal Shock Resistance, points 20
14

Alloy Composition

Carbon (C), % 0 to 0.15
0.050 to 0.15
Chromium (Cr), % 0
1.0 to 1.5
Copper (Cu), % 72.3 to 80.8
0
Iron (Fe), % 0.5 to 1.5
96.1 to 97.7
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0.3 to 0.6
Molybdenum (Mo), % 0
0.44 to 0.65
Nickel (Ni), % 18 to 22
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.025
Silicon (Si), % 0 to 0.5
0.5 to 1.0
Sulfur (S), % 0 to 0.020
0 to 0.025
Residuals, % 0 to 0.5
0