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C96300 Copper-nickel vs. CR025A Copper

Both C96300 copper-nickel and CR025A copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is CR025A copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
15
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 49
43
Tensile Strength: Ultimate (UTS), MPa 580
230
Tensile Strength: Yield (Proof), MPa 430
140

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 240
200
Melting Completion (Liquidus), °C 1200
1090
Melting Onset (Solidus), °C 1150
1040
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
370
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
99
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
99

Otherwise Unclassified Properties

Base Metal Price, % relative 42
31
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 5.1
2.6
Embodied Energy, MJ/kg 76
41
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
31
Resilience: Unit (Modulus of Resilience), kJ/m3 720
83
Stiffness to Weight: Axial, points 8.2
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 18
7.1
Strength to Weight: Bending, points 17
9.3
Thermal Diffusivity, mm2/s 10
110
Thermal Shock Resistance, points 20
8.1

Alloy Composition

Bismuth (Bi), % 0
0 to 0.00050
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 72.3 to 80.8
99.9 to 99.96
Iron (Fe), % 0.5 to 1.5
0
Lead (Pb), % 0 to 0.010
0 to 0.0050
Manganese (Mn), % 0.25 to 1.5
0
Nickel (Ni), % 18 to 22
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0.040 to 0.060
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.015
Sulfur (S), % 0 to 0.020
0
Residuals, % 0 to 0.5
0