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C96300 Copper-nickel vs. Grade M35-1 Nickel

C96300 copper-nickel belongs to the copper alloys classification, while grade M35-1 nickel belongs to the nickel alloys. They have 52% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is grade M35-1 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
160
Elongation at Break, % 11
28
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 49
62
Tensile Strength: Ultimate (UTS), MPa 580
500
Tensile Strength: Yield (Proof), MPa 430
190

Thermal Properties

Latent Heat of Fusion, J/g 230
280
Maximum Temperature: Mechanical, °C 240
900
Melting Completion (Liquidus), °C 1200
1280
Melting Onset (Solidus), °C 1150
1240
Specific Heat Capacity, J/kg-K 400
430
Thermal Conductivity, W/m-K 37
22
Thermal Expansion, µm/m-K 16
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 42
55
Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 5.1
8.2
Embodied Energy, MJ/kg 76
120
Embodied Water, L/kg 290
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
110
Resilience: Unit (Modulus of Resilience), kJ/m3 720
120
Stiffness to Weight: Axial, points 8.2
10
Stiffness to Weight: Bending, points 19
21
Strength to Weight: Axial, points 18
16
Strength to Weight: Bending, points 17
16
Thermal Diffusivity, mm2/s 10
5.7
Thermal Shock Resistance, points 20
17

Alloy Composition

Carbon (C), % 0 to 0.15
0 to 0.35
Copper (Cu), % 72.3 to 80.8
26 to 33
Iron (Fe), % 0.5 to 1.5
0 to 3.5
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0 to 1.5
Nickel (Ni), % 18 to 22
59.8 to 74
Niobium (Nb), % 0.5 to 1.5
0 to 0.5
Phosphorus (P), % 0 to 0.020
0 to 0.030
Silicon (Si), % 0 to 0.5
0 to 1.3
Sulfur (S), % 0 to 0.020
0 to 0.030
Residuals, % 0 to 0.5
0