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C96300 Copper-nickel vs. C17300 Copper

Both C96300 copper-nickel and C17300 copper are copper alloys. They have 78% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
3.0 to 23
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 49
45
Tensile Strength: Ultimate (UTS), MPa 580
500 to 1380
Tensile Strength: Yield (Proof), MPa 430
160 to 1200

Thermal Properties

Latent Heat of Fusion, J/g 230
230
Maximum Temperature: Mechanical, °C 240
270
Melting Completion (Liquidus), °C 1200
980
Melting Onset (Solidus), °C 1150
870
Specific Heat Capacity, J/kg-K 400
380
Thermal Conductivity, W/m-K 37
110
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
22
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
23

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 5.1
9.4
Embodied Energy, MJ/kg 76
150
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
40 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 720
110 to 5410
Stiffness to Weight: Axial, points 8.2
7.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
16 to 44
Strength to Weight: Bending, points 17
16 to 31
Thermal Diffusivity, mm2/s 10
32
Thermal Shock Resistance, points 20
17 to 48

Alloy Composition

Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
1.8 to 2.0
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 72.3 to 80.8
95.5 to 97.8
Iron (Fe), % 0.5 to 1.5
0 to 0.4
Lead (Pb), % 0 to 0.010
0.2 to 0.6
Manganese (Mn), % 0.25 to 1.5
0
Nickel (Ni), % 18 to 22
0.2 to 0.6
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0 to 0.2
Sulfur (S), % 0 to 0.020
0
Residuals, % 0
0 to 0.5