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C96400 Copper-nickel vs. S44535 Stainless Steel

C96400 copper-nickel belongs to the copper alloys classification, while S44535 stainless steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is S44535 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
200
Elongation at Break, % 25
28
Poisson's Ratio 0.33
0.27
Shear Modulus, GPa 51
78
Tensile Strength: Ultimate (UTS), MPa 490
450
Tensile Strength: Yield (Proof), MPa 260
290

Thermal Properties

Latent Heat of Fusion, J/g 240
290
Maximum Temperature: Mechanical, °C 260
1000
Melting Completion (Liquidus), °C 1240
1430
Melting Onset (Solidus), °C 1170
1390
Specific Heat Capacity, J/kg-K 400
480
Thermal Conductivity, W/m-K 28
21
Thermal Expansion, µm/m-K 15
11

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
2.6
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
3.1

Otherwise Unclassified Properties

Base Metal Price, % relative 45
11
Density, g/cm3 8.9
7.7
Embodied Carbon, kg CO2/kg material 5.9
2.4
Embodied Energy, MJ/kg 87
34
Embodied Water, L/kg 280
140

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
110
Resilience: Unit (Modulus of Resilience), kJ/m3 250
200
Stiffness to Weight: Axial, points 8.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 15
16
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 7.8
5.6
Thermal Shock Resistance, points 17
15

Alloy Composition

Aluminum (Al), % 0
0 to 0.5
Carbon (C), % 0 to 0.15
0 to 0.030
Chromium (Cr), % 0
20 to 24
Copper (Cu), % 62.3 to 71.3
0 to 0.5
Iron (Fe), % 0.25 to 1.5
73.2 to 79.6
Lanthanum (La), % 0
0.040 to 0.2
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0 to 1.5
0.3 to 0.8
Nickel (Ni), % 28 to 32
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.050
Silicon (Si), % 0 to 0.5
0 to 0.5
Sulfur (S), % 0 to 0.020
0 to 0.020
Titanium (Ti), % 0
0.030 to 0.2
Residuals, % 0 to 0.5
0