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C96700 Copper vs. Solder Alloy 201

C96700 copper belongs to the copper alloys classification, while solder alloy 201 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C96700 copper and the bottom bar is solder alloy 201.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
50
Elongation at Break, % 10
38
Poisson's Ratio 0.33
0.35
Shear Modulus, GPa 53
19
Tensile Strength: Ultimate (UTS), MPa 1210
41

Thermal Properties

Latent Heat of Fusion, J/g 250
64
Melting Completion (Liquidus), °C 1170
240
Melting Onset (Solidus), °C 1110
240
Specific Heat Capacity, J/kg-K 400
220
Thermal Conductivity, W/m-K 30
28
Thermal Expansion, µm/m-K 15
21

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.3
Embodied Carbon, kg CO2/kg material 9.5
15
Embodied Energy, MJ/kg 140
250
Embodied Water, L/kg 280
1320

Common Calculations

Stiffness to Weight: Axial, points 8.9
3.8
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 38
1.6
Strength to Weight: Bending, points 29
3.6
Thermal Diffusivity, mm2/s 8.5
17
Thermal Shock Resistance, points 40
2.7

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
4.5 to 5.5
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 1.1 to 1.2
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 62.4 to 68.8
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.010
0 to 0.070
Manganese (Mn), % 0.4 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silicon (Si), % 0 to 0.15
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
94 to 95.5
Titanium (Ti), % 0.15 to 0.35
0
Zinc (Zn), % 0
0 to 0.0010
Zirconium (Zr), % 0.15 to 0.35
0
Residuals, % 0 to 0.5
0