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C96900 Copper-nickel vs. Solder Alloy 112

C96900 copper-nickel belongs to the copper alloys classification, while solder alloy 112 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C96900 copper-nickel and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 4.5
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 45
12
Tensile Strength: Ultimate (UTS), MPa 850
41

Thermal Properties

Latent Heat of Fusion, J/g 210
41
Melting Completion (Liquidus), °C 1060
220
Melting Onset (Solidus), °C 960
180
Specific Heat Capacity, J/kg-K 380
180
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 9.2
10

Otherwise Unclassified Properties

Density, g/cm3 8.8
9.3
Embodied Carbon, kg CO2/kg material 4.6
9.4
Embodied Energy, MJ/kg 72
160
Embodied Water, L/kg 360
830

Common Calculations

Stiffness to Weight: Axial, points 7.7
2.0
Stiffness to Weight: Bending, points 19
11
Strength to Weight: Axial, points 27
1.2
Strength to Weight: Bending, points 23
2.8
Thermal Shock Resistance, points 30
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.6 to 78
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
49 to 50.5
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silicon (Si), % 0 to 0.3
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 7.5 to 8.5
49.5 to 50.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0