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C96900 Copper-nickel vs. Solder Alloy 601

C96900 copper-nickel belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 19 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C96900 copper-nickel and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 4.5
83
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 45
11
Tensile Strength: Ultimate (UTS), MPa 850
12

Thermal Properties

Latent Heat of Fusion, J/g 210
43
Melting Completion (Liquidus), °C 1060
120
Melting Onset (Solidus), °C 960
120
Specific Heat Capacity, J/kg-K 380
230
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.2
14

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.3
Embodied Water, L/kg 360
1330

Common Calculations

Stiffness to Weight: Axial, points 7.7
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 27
0.45
Strength to Weight: Bending, points 23
1.6
Thermal Shock Resistance, points 30
1.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.6 to 78
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silicon (Si), % 0 to 0.3
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 7.5 to 8.5
47.5 to 48.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0