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C96900 Copper-nickel vs. Solder Alloy 811

C96900 copper-nickel belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C96900 copper-nickel and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
52
Elongation at Break, % 4.5
38
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 45
19
Tensile Strength: Ultimate (UTS), MPa 850
53

Thermal Properties

Latent Heat of Fusion, J/g 210
63
Melting Completion (Liquidus), °C 1060
200
Melting Onset (Solidus), °C 960
190
Specific Heat Capacity, J/kg-K 380
230
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
14
Electrical Conductivity: Equal Weight (Specific), % IACS 9.2
17

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.3
Embodied Carbon, kg CO2/kg material 4.6
14
Embodied Energy, MJ/kg 72
240
Embodied Water, L/kg 360
1200

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 27
2.0
Strength to Weight: Bending, points 23
4.3
Thermal Shock Resistance, points 30
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.6 to 78
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silicon (Si), % 0 to 0.3
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 7.5 to 8.5
87.8 to 89.7
Zinc (Zn), % 0 to 0.5
7.5 to 8.5
Residuals, % 0 to 0.5
0