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C97400 Nickel Silver vs. CC383H Copper-nickel

Both C97400 nickel silver and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 77% of their average alloy composition in common.

For each property being compared, the top bar is C97400 nickel silver and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 70
130
Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 20
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 44
52
Tensile Strength: Ultimate (UTS), MPa 260
490
Tensile Strength: Yield (Proof), MPa 120
260

Thermal Properties

Latent Heat of Fusion, J/g 190
240
Maximum Temperature: Mechanical, °C 180
260
Melting Completion (Liquidus), °C 1100
1180
Melting Onset (Solidus), °C 1070
1130
Specific Heat Capacity, J/kg-K 380
410
Thermal Conductivity, W/m-K 27
29
Thermal Expansion, µm/m-K 18
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 33
44
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 4.1
5.7
Embodied Energy, MJ/kg 64
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 43
84
Resilience: Unit (Modulus of Resilience), kJ/m3 59
250
Stiffness to Weight: Axial, points 7.5
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 8.5
15
Strength to Weight: Bending, points 11
16
Thermal Diffusivity, mm2/s 8.3
8.1
Thermal Shock Resistance, points 8.8
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 58 to 61
64 to 69.1
Iron (Fe), % 0 to 1.5
0.5 to 1.5
Lead (Pb), % 4.5 to 5.5
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0 to 0.5
0.6 to 1.2
Nickel (Ni), % 15.5 to 17
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 2.5 to 3.5
0
Zinc (Zn), % 10 to 19.5
0 to 0.5
Residuals, % 0 to 1.0
0