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C97400 Nickel Silver vs. C96200 Copper-nickel

Both C97400 nickel silver and C96200 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 71% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C97400 nickel silver and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 20
23
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 44
46
Tensile Strength: Ultimate (UTS), MPa 260
350
Tensile Strength: Yield (Proof), MPa 120
190

Thermal Properties

Latent Heat of Fusion, J/g 190
220
Maximum Temperature: Mechanical, °C 180
220
Melting Completion (Liquidus), °C 1100
1150
Melting Onset (Solidus), °C 1070
1100
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 27
45
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
11

Otherwise Unclassified Properties

Base Metal Price, % relative 33
36
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 4.1
3.8
Embodied Energy, MJ/kg 64
58
Embodied Water, L/kg 320
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 43
68
Resilience: Unit (Modulus of Resilience), kJ/m3 59
150
Stiffness to Weight: Axial, points 7.5
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 8.5
11
Strength to Weight: Bending, points 11
13
Thermal Diffusivity, mm2/s 8.3
13
Thermal Shock Resistance, points 8.8
12

Alloy Composition

Carbon (C), % 0
0 to 0.1
Copper (Cu), % 58 to 61
83.6 to 90
Iron (Fe), % 0 to 1.5
1.0 to 1.8
Lead (Pb), % 4.5 to 5.5
0 to 0.010
Manganese (Mn), % 0 to 0.5
0 to 1.5
Nickel (Ni), % 15.5 to 17
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 2.5 to 3.5
0
Zinc (Zn), % 10 to 19.5
0
Residuals, % 0
0 to 0.5