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C99300 Copper vs. Solder Alloy 111

C99300 copper belongs to the copper alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C99300 copper and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 200
14
Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 2.0
35
Poisson's Ratio 0.33
0.4
Shear Modulus, GPa 46
12
Tensile Strength: Ultimate (UTS), MPa 660
41

Thermal Properties

Latent Heat of Fusion, J/g 240
41
Melting Completion (Liquidus), °C 1080
220
Melting Onset (Solidus), °C 1070
180
Specific Heat Capacity, J/kg-K 450
180
Thermal Conductivity, W/m-K 43
48
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
11

Otherwise Unclassified Properties

Density, g/cm3 8.2
9.3
Embodied Carbon, kg CO2/kg material 4.5
9.4
Embodied Energy, MJ/kg 70
160
Embodied Water, L/kg 400
830

Common Calculations

Stiffness to Weight: Axial, points 8.3
2.0
Stiffness to Weight: Bending, points 20
12
Strength to Weight: Axial, points 22
1.2
Strength to Weight: Bending, points 20
2.8
Thermal Diffusivity, mm2/s 12
29
Thermal Shock Resistance, points 22
3.5

Alloy Composition

Aluminum (Al), % 10.7 to 11.5
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Cobalt (Co), % 1.0 to 2.0
0
Copper (Cu), % 68.6 to 74.4
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.020
48.8 to 50.5
Nickel (Ni), % 13.5 to 16.5
0 to 0.010
Silicon (Si), % 0 to 0.020
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.050
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.3
0