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C99300 Copper vs. Solder Alloy 201

C99300 copper belongs to the copper alloys classification, while solder alloy 201 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C99300 copper and the bottom bar is solder alloy 201.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 200
13
Elastic (Young's, Tensile) Modulus, GPa 120
50
Elongation at Break, % 2.0
38
Poisson's Ratio 0.33
0.35
Shear Modulus, GPa 46
19
Tensile Strength: Ultimate (UTS), MPa 660
41

Thermal Properties

Latent Heat of Fusion, J/g 240
64
Melting Completion (Liquidus), °C 1080
240
Melting Onset (Solidus), °C 1070
240
Specific Heat Capacity, J/kg-K 450
220
Thermal Conductivity, W/m-K 43
28
Thermal Expansion, µm/m-K 17
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
15

Otherwise Unclassified Properties

Density, g/cm3 8.2
7.3
Embodied Carbon, kg CO2/kg material 4.5
15
Embodied Energy, MJ/kg 70
250
Embodied Water, L/kg 400
1320

Common Calculations

Stiffness to Weight: Axial, points 8.3
3.8
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 22
1.6
Strength to Weight: Bending, points 20
3.6
Thermal Diffusivity, mm2/s 12
17
Thermal Shock Resistance, points 22
2.7

Alloy Composition

Aluminum (Al), % 10.7 to 11.5
0 to 0.0010
Antimony (Sb), % 0
4.5 to 5.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Cobalt (Co), % 1.0 to 2.0
0
Copper (Cu), % 68.6 to 74.4
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 13.5 to 16.5
0 to 0.010
Silicon (Si), % 0 to 0.020
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.050
94 to 95.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.3
0