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C99300 Copper vs. Solder Alloy 601

C99300 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C99300 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 200
5.0
Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 2.0
83
Poisson's Ratio 0.33
0.41
Shear Modulus, GPa 46
11
Tensile Strength: Ultimate (UTS), MPa 660
12

Thermal Properties

Latent Heat of Fusion, J/g 240
43
Melting Completion (Liquidus), °C 1080
120
Melting Onset (Solidus), °C 1070
120
Specific Heat Capacity, J/kg-K 450
230
Thermal Conductivity, W/m-K 43
34
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
14

Otherwise Unclassified Properties

Density, g/cm3 8.2
7.3
Embodied Water, L/kg 400
1330

Common Calculations

Stiffness to Weight: Axial, points 8.3
2.3
Stiffness to Weight: Bending, points 20
14
Strength to Weight: Axial, points 22
0.45
Strength to Weight: Bending, points 20
1.6
Thermal Diffusivity, mm2/s 12
20
Thermal Shock Resistance, points 22
1.2

Alloy Composition

Aluminum (Al), % 10.7 to 11.5
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Cobalt (Co), % 1.0 to 2.0
0
Copper (Cu), % 68.6 to 74.4
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 13.5 to 16.5
0 to 0.010
Silicon (Si), % 0 to 0.020
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.050
47.5 to 48.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.3
0