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C99300 Copper vs. Monel K-500

C99300 copper belongs to the copper alloys classification, while Monel K-500 belongs to the nickel alloys. They have 48% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C99300 copper and the bottom bar is Monel K-500.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 2.0
25 to 36
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 46
61
Tensile Strength: Ultimate (UTS), MPa 660
640 to 1100
Tensile Strength: Yield (Proof), MPa 380
310 to 880

Thermal Properties

Latent Heat of Fusion, J/g 240
270
Maximum Temperature: Mechanical, °C 250
900
Melting Completion (Liquidus), °C 1080
1350
Melting Onset (Solidus), °C 1070
1320
Specific Heat Capacity, J/kg-K 450
440
Thermal Conductivity, W/m-K 43
18
Thermal Expansion, µm/m-K 17
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
3.1
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
3.2

Otherwise Unclassified Properties

Base Metal Price, % relative 35
50
Density, g/cm3 8.2
8.7
Embodied Carbon, kg CO2/kg material 4.5
8.1
Embodied Energy, MJ/kg 70
120
Embodied Water, L/kg 400
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11
180 to 260
Resilience: Unit (Modulus of Resilience), kJ/m3 590
300 to 2420
Stiffness to Weight: Axial, points 8.3
10
Stiffness to Weight: Bending, points 20
21
Strength to Weight: Axial, points 22
21 to 35
Strength to Weight: Bending, points 20
19 to 27
Thermal Diffusivity, mm2/s 12
4.8
Thermal Shock Resistance, points 22
21 to 36

Alloy Composition

Aluminum (Al), % 10.7 to 11.5
2.3 to 3.2
Carbon (C), % 0
0 to 0.18
Cobalt (Co), % 1.0 to 2.0
0
Copper (Cu), % 68.6 to 74.4
27 to 33
Iron (Fe), % 0.4 to 1.0
0 to 2.0
Lead (Pb), % 0 to 0.020
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 13.5 to 16.5
63 to 70.4
Silicon (Si), % 0 to 0.020
0 to 0.5
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 0 to 0.050
0
Titanium (Ti), % 0
0.35 to 0.85
Residuals, % 0 to 0.3
0