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N08926 Stainless Steel vs. C96200 Copper-nickel

N08926 stainless steel belongs to the iron alloys classification, while C96200 copper-nickel belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is N08926 stainless steel and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
120
Elongation at Break, % 40
23
Poisson's Ratio 0.28
0.34
Shear Modulus, GPa 80
46
Tensile Strength: Ultimate (UTS), MPa 740
350
Tensile Strength: Yield (Proof), MPa 330
190

Thermal Properties

Latent Heat of Fusion, J/g 300
220
Maximum Temperature: Mechanical, °C 1100
220
Melting Completion (Liquidus), °C 1460
1150
Melting Onset (Solidus), °C 1410
1100
Specific Heat Capacity, J/kg-K 460
390
Thermal Conductivity, W/m-K 12
45
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
11
Electrical Conductivity: Equal Weight (Specific), % IACS 1.9
11

Otherwise Unclassified Properties

Base Metal Price, % relative 33
36
Density, g/cm3 8.1
8.9
Embodied Carbon, kg CO2/kg material 6.2
3.8
Embodied Energy, MJ/kg 84
58
Embodied Water, L/kg 200
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 240
68
Resilience: Unit (Modulus of Resilience), kJ/m3 270
150
Stiffness to Weight: Axial, points 14
7.8
Stiffness to Weight: Bending, points 24
19
Strength to Weight: Axial, points 25
11
Strength to Weight: Bending, points 22
13
Thermal Diffusivity, mm2/s 3.2
13
Thermal Shock Resistance, points 16
12

Alloy Composition

Carbon (C), % 0 to 0.020
0 to 0.1
Chromium (Cr), % 19 to 21
0
Copper (Cu), % 0.5 to 1.5
83.6 to 90
Iron (Fe), % 41.7 to 50.4
1.0 to 1.8
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 2.0
0 to 1.5
Molybdenum (Mo), % 6.0 to 7.0
0
Nickel (Ni), % 24 to 26
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Nitrogen (N), % 0.15 to 0.25
0
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 0 to 0.5
0 to 0.5
Sulfur (S), % 0 to 0.010
0 to 0.020
Residuals, % 0
0 to 0.5