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N10665 Nickel vs. C82200 Copper

N10665 nickel belongs to the nickel alloys classification, while C82200 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is N10665 nickel and the bottom bar is C82200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 220
120
Elongation at Break, % 45
8.0 to 20
Poisson's Ratio 0.31
0.34
Rockwell B Hardness 86
60 to 96
Shear Modulus, GPa 84
44
Tensile Strength: Ultimate (UTS), MPa 860
390 to 660
Tensile Strength: Yield (Proof), MPa 400
210 to 520

Thermal Properties

Latent Heat of Fusion, J/g 310
220
Maximum Temperature: Mechanical, °C 900
230
Melting Completion (Liquidus), °C 1620
1080
Melting Onset (Solidus), °C 1570
1040
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 11
180
Thermal Expansion, µm/m-K 10
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.3
45
Electrical Conductivity: Equal Weight (Specific), % IACS 1.2
46

Otherwise Unclassified Properties

Base Metal Price, % relative 75
55
Density, g/cm3 9.3
8.9
Embodied Carbon, kg CO2/kg material 15
4.8
Embodied Energy, MJ/kg 200
74
Embodied Water, L/kg 270
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 320
49 to 66
Resilience: Unit (Modulus of Resilience), kJ/m3 360
180 to 1130
Stiffness to Weight: Axial, points 13
7.4
Stiffness to Weight: Bending, points 22
18
Strength to Weight: Axial, points 26
12 to 20
Strength to Weight: Bending, points 22
13 to 19
Thermal Diffusivity, mm2/s 3.1
53
Thermal Shock Resistance, points 27
14 to 23

Alloy Composition

Beryllium (Be), % 0
0.35 to 0.8
Carbon (C), % 0 to 0.020
0
Chromium (Cr), % 0 to 1.0
0
Cobalt (Co), % 0 to 1.0
0 to 0.3
Copper (Cu), % 0
97.4 to 98.7
Iron (Fe), % 0 to 2.0
0
Manganese (Mn), % 0 to 1.0
0
Molybdenum (Mo), % 26 to 30
0
Nickel (Ni), % 64.8 to 74
1.0 to 2.0
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 0.1
0
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.5