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S39274 Stainless Steel vs. C96200 Copper-nickel

S39274 stainless steel belongs to the iron alloys classification, while C96200 copper-nickel belongs to the copper alloys. There are 28 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is S39274 stainless steel and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 210
120
Elongation at Break, % 17
23
Poisson's Ratio 0.27
0.34
Shear Modulus, GPa 81
46
Tensile Strength: Ultimate (UTS), MPa 900
350
Tensile Strength: Yield (Proof), MPa 620
190

Thermal Properties

Latent Heat of Fusion, J/g 300
220
Maximum Temperature: Mechanical, °C 1100
220
Melting Completion (Liquidus), °C 1480
1150
Melting Onset (Solidus), °C 1430
1100
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 16
45
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.2
11
Electrical Conductivity: Equal Weight (Specific), % IACS 2.4
11

Otherwise Unclassified Properties

Base Metal Price, % relative 24
36
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 4.3
3.8
Embodied Energy, MJ/kg 60
58
Embodied Water, L/kg 180
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 140
68
Resilience: Unit (Modulus of Resilience), kJ/m3 940
150
Stiffness to Weight: Axial, points 14
7.8
Stiffness to Weight: Bending, points 25
19
Strength to Weight: Axial, points 32
11
Strength to Weight: Bending, points 26
13
Thermal Diffusivity, mm2/s 4.2
13
Thermal Shock Resistance, points 25
12

Alloy Composition

Carbon (C), % 0 to 0.030
0 to 0.1
Chromium (Cr), % 24 to 26
0
Copper (Cu), % 0.2 to 0.8
83.6 to 90
Iron (Fe), % 57 to 65.6
1.0 to 1.8
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.0
0 to 1.5
Molybdenum (Mo), % 2.5 to 3.5
0
Nickel (Ni), % 6.0 to 8.0
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Nitrogen (N), % 0.24 to 0.32
0
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 0 to 0.8
0 to 0.5
Sulfur (S), % 0 to 0.020
0 to 0.020
Tungsten (W), % 1.5 to 2.5
0
Residuals, % 0
0 to 0.5