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S44625 Stainless Steel vs. ASTM A369 Grade FPA

Both S44625 stainless steel and ASTM A369 grade FPA are iron alloys. They have 72% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is S44625 stainless steel and the bottom bar is ASTM A369 grade FPA.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 200
190
Elongation at Break, % 22
27
Fatigue Strength, MPa 240
180
Poisson's Ratio 0.27
0.29
Shear Modulus, GPa 80
73
Shear Strength, MPa 370
240
Tensile Strength: Ultimate (UTS), MPa 590
380
Tensile Strength: Yield (Proof), MPa 360
240

Thermal Properties

Latent Heat of Fusion, J/g 290
250
Maximum Temperature: Mechanical, °C 1100
400
Melting Completion (Liquidus), °C 1440
1460
Melting Onset (Solidus), °C 1400
1420
Specific Heat Capacity, J/kg-K 480
470
Thermal Conductivity, W/m-K 17
52
Thermal Expansion, µm/m-K 11
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 2.2
7.1
Electrical Conductivity: Equal Weight (Specific), % IACS 2.6
8.1

Otherwise Unclassified Properties

Base Metal Price, % relative 14
1.8
Density, g/cm3 7.7
7.8
Embodied Carbon, kg CO2/kg material 2.8
1.4
Embodied Energy, MJ/kg 39
18
Embodied Water, L/kg 160
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110
89
Resilience: Unit (Modulus of Resilience), kJ/m3 310
150
Stiffness to Weight: Axial, points 15
13
Stiffness to Weight: Bending, points 25
24
Strength to Weight: Axial, points 21
13
Strength to Weight: Bending, points 20
15
Thermal Diffusivity, mm2/s 4.6
14
Thermal Shock Resistance, points 19
12

Alloy Composition

Carbon (C), % 0 to 0.010
0 to 0.25
Chromium (Cr), % 25 to 27.5
0
Copper (Cu), % 0 to 0.2
0
Iron (Fe), % 69.4 to 74.3
98.3 to 99.63
Manganese (Mn), % 0 to 0.4
0.27 to 0.93
Molybdenum (Mo), % 0.75 to 1.5
0
Nickel (Ni), % 0 to 0.5
0
Nitrogen (N), % 0 to 0.015
0
Phosphorus (P), % 0 to 0.020
0 to 0.035
Silicon (Si), % 0 to 0.4
0.1 to 0.5
Sulfur (S), % 0 to 0.020
0 to 0.035