Full-Hard (H04) C18900 Copper
H04 C18900 copper is C18900 copper in the H04 (full hard) temper. The graph bars on the material properties cards below compare H04 C18900 copper to: wrought coppers (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Elastic (Young's, Tensile) Modulus
120 GPa 17 x 106 psi
Elongation at Break
14 %
Poisson's Ratio
0.34
Shear Modulus
43 GPa 6.2 x 106 psi
Shear Strength
300 MPa 44 x 103 psi
Tensile Strength: Ultimate (UTS)
500 MPa 73 x 103 psi
Tensile Strength: Yield (Proof)
390 MPa 56 x 103 psi
Thermal Properties
Latent Heat of Fusion
210 J/g
Maximum Temperature: Mechanical
200 °C 390 °F
Melting Completion (Liquidus)
1080 °C 1970 °F
Melting Onset (Solidus)
1020 °C 1860 °F
Specific Heat Capacity
390 J/kg-K 0.092 BTU/lb-°F
Thermal Conductivity
130 W/m-K 75 BTU/h-ft-°F
Thermal Expansion
17 µm/m-K
Electrical Properties
Electrical Conductivity: Equal Volume
30 % IACS
Electrical Conductivity: Equal Weight (Specific)
30 % IACS
Otherwise Unclassified Properties
Base Metal Price
31 % relative
Density
8.9 g/cm3 560 lb/ft3
Embodied Carbon
2.7 kg CO2/kg material
Embodied Energy
42 MJ/kg 18 x 103 BTU/lb
Embodied Water
310 L/kg 37 gal/lb
Common Calculations
Resilience: Ultimate (Unit Rupture Work)
65 MJ/m3
Resilience: Unit (Modulus of Resilience)
660 kJ/m3
Stiffness to Weight: Axial
7.2 points
Stiffness to Weight: Bending
18 points
Strength to Weight: Axial
16 points
Strength to Weight: Bending
16 points
Thermal Diffusivity
38 mm2/s
Thermal Shock Resistance
18 points
Alloy Composition
Cu | 97.7 to 99.15 | |
Sn | 0.6 to 0.9 | |
Si | 0.15 to 0.4 | |
Mn | 0.1 to 0.3 | |
Zn | 0 to 0.1 | |
P | 0 to 0.050 | |
Pb | 0 to 0.020 | |
Al | 0 to 0.010 | |
res. | 0 to 0.5 |
All values are % weight. Ranges represent what is permitted under applicable standards.
Followup Questions
Further Reading
CRC Materials Science and Engineering Handbook, 4th ed., James F. Shackelford et al. (editors), 2015