Full-Hard (H04) C73100 Nickel Silver
H04 C73100 nickel silver is C73100 nickel silver in the H04 (full hard) temper. The graph bars on the material properties cards below compare H04 C73100 nickel silver to: wrought copper-nickels (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Elastic (Young's, Tensile) Modulus
110 GPa 16 x 106 psi
Elongation at Break
4.6 %
Poisson's Ratio
0.32
Shear Modulus
43 GPa 6.2 x 106 psi
Shear Strength
340 MPa 50 x 103 psi
Tensile Strength: Ultimate (UTS)
590 MPa 86 x 103 psi
Tensile Strength: Yield (Proof)
590 MPa 86 x 103 psi
Thermal Properties
Latent Heat of Fusion
190 J/g
Maximum Temperature: Mechanical
170 °C 330 °F
Melting Completion (Liquidus)
1030 °C 1880 °F
Melting Onset (Solidus)
1000 °C 1830 °F
Specific Heat Capacity
390 J/kg-K 0.093 BTU/lb-°F
Thermal Conductivity
35 W/m-K 20 BTU/h-ft-°F
Thermal Expansion
19 µm/m-K
Electrical Properties
Electrical Conductivity: Equal Volume
7.5 % IACS
Electrical Conductivity: Equal Weight (Specific)
8.0 % IACS
Otherwise Unclassified Properties
Base Metal Price
28 % relative
Density
8.4 g/cm3 530 lb/ft3
Embodied Carbon
3.0 kg CO2/kg material
Embodied Energy
49 MJ/kg 21 x 103 BTU/lb
Embodied Water
310 L/kg 37 gal/lb
Common Calculations
Resilience: Ultimate (Unit Rupture Work)
27 MJ/m3
Resilience: Unit (Modulus of Resilience)
1560 kJ/m3
Stiffness to Weight: Axial
7.5 points
Stiffness to Weight: Bending
19 points
Strength to Weight: Axial
19 points
Strength to Weight: Bending
19 points
Thermal Diffusivity
11 mm2/s
Thermal Shock Resistance
20 points
Alloy Composition
Cu | 70.8 to 78 | |
Zn | 18 to 22 | |
Ni | 4.0 to 6.0 | |
Mn | 0 to 0.5 | |
Fe | 0 to 0.1 | |
Sn | 0 to 0.1 | |
Pb | 0 to 0.050 | |
res. | 0 to 0.5 |
All values are % weight. Ranges represent what is permitted under applicable standards.
Followup Questions
Further Reading
CRC Materials Science and Engineering Handbook, 4th ed., James F. Shackelford et al. (editors), 2015