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Full-Hard and Stress Relieved (HR04) C66200 Brass

HR04 C66200 brass is C66200 brass in the HR04 (full-hard and stress relieved) temper. The graph bars on the material properties cards below compare HR04 C66200 brass to: wrought brasses (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.

Mechanical Properties

Elastic (Young's, Tensile) Modulus

110 GPa 16 x 106 psi

Elongation at Break

8.0 %

Poisson's Ratio

0.33

Shear Modulus

42 GPa 6.2 x 106 psi

Shear Strength

300 MPa 44 x 103 psi

Tensile Strength: Ultimate (UTS)

520 MPa 75 x 103 psi

Tensile Strength: Yield (Proof)

480 MPa 70 x 103 psi

Thermal Properties

Latent Heat of Fusion

200 J/g

Maximum Temperature: Mechanical

180 °C 360 °F

Melting Completion (Liquidus)

1070 °C 1950 °F

Melting Onset (Solidus)

1030 °C 1880 °F

Specific Heat Capacity

390 J/kg-K 0.092 BTU/lb-°F

Thermal Conductivity

150 W/m-K 87 BTU/h-ft-°F

Thermal Expansion

18 µm/m-K

Electrical Properties

Electrical Conductivity: Equal Volume

35 % IACS

Electrical Conductivity: Equal Weight (Specific)

36 % IACS

Otherwise Unclassified Properties

Base Metal Price

29 % relative

Density

8.7 g/cm3 540 lb/ft3

Embodied Carbon

2.7 kg CO2/kg material

Embodied Energy

43 MJ/kg 19 x 103 BTU/lb

Embodied Water

320 L/kg 38 gal/lb

Common Calculations

Resilience: Ultimate (Unit Rupture Work)

40 MJ/m3

Resilience: Unit (Modulus of Resilience)

1030 kJ/m3

Stiffness to Weight: Axial

7.2 points

Stiffness to Weight: Bending

19 points

Strength to Weight: Axial

17 points

Strength to Weight: Bending

16 points

Thermal Diffusivity

45 mm2/s

Thermal Shock Resistance

18 points

Alloy Composition

Copper (Cu)Cu 86.6 to 91
Zinc (Zn)Zn 6.5 to 12.9
Nickel (Ni)Ni 0.3 to 1.0
Tin (Sn)Sn 0.2 to 0.7
Phosphorus (P)P 0.050 to 0.2
Iron (Fe)Fe 0 to 0.050
Lead (Pb)Pb 0 to 0.050
Residualsres. 0 to 0.5

All values are % weight. Ranges represent what is permitted under applicable standards.

Followup Questions