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Plastic-Processed Siliceous Porcelain (IEC 60672 Type C-110)

C-110 siliceous porcelain is a grade of engineering porcelain. The graph bars on the material properties cards below compare C-110 siliceous porcelain to other oxide-based engineering ceramics (top) and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.

Mechanical Properties

Compressive (Crushing) Strength

590 MPa 86 x 103 psi

Elastic (Young's, Tensile) Modulus

67 GPa 9.7 x 106 psi

Flexural Strength

48 MPa 7.0 x 103 psi

Fracture Toughness

2.0 MPa-m1/2 1.8 x 103 psi-in1/2

Knoop Hardness

600

Poisson's Ratio

0.17

Rockwell R Hardness

60

Shear Modulus

34 GPa 4.9 x 106 psi

Tensile Strength: Ultimate (UTS)

130 MPa 19 x 103 psi

Electrical Properties

Dielectric Constant (Relative Permittivity) At 1 Hz

6.3

Dielectric Constant (Relative Permittivity) At 1 MHz

6.5

Dielectric Strength (Breakdown Potential)

23 kV/mm 0.88 V/mil

Electrical Dissipation At 1 Hz

0.023

Electrical Dissipation At 1 MHz

0.011

Electrical Resistivity Order of Magnitude

11 10x Ω-m

Other Material Properties

Density

2.4 g/cm3 150 lb/ft3

Maximum Temperature: Mechanical

1170 °C 2130 °F

Maximum Thermal Shock

170 °C 330 °F

Specific Heat Capacity

830 J/kg-K 0.2 BTU/lb-°F

Thermal Conductivity

1.8 W/m-K 1.0 BTU/h-ft-°F

Thermal Expansion

4.8 µm/m-K

Common Calculations

Stiffness to Weight: Axial

16 points

Stiffness to Weight: Bending

58 points

Strength to Weight: Axial

15 points

Strength to Weight: Bending

24 points

Thermal Diffusivity

0.9 mm2/s

Thermal Shock Resistance

29 points

Followup Questions

Further Reading

ASTM C242: Standard Terminology of Ceramic Whitewares and Related Products

IEC 60672-3: Ceramic and glass-insulating materials - Part 3: Specifications for individual materials

Springer Handbook of Condensed Matter and Materials Data, W. Martienssen and H. Warlimont (editors), 2005

CRC Materials Science and Engineering Handbook, 4th ed., James F. Shackelford et al. (editors), 2015