Reaction Bonded Silicon Nitride (IEC 60672 Type C-930)
Reaction bonded silicon nitride is a grade of silicon nitride. The graph bars on the material properties cards below compare reaction bonded silicon nitride to other non-oxide engineering ceramics (top) and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Compressive (Crushing) Strength
600 MPa 87 x 103 psi
Elastic (Young's, Tensile) Modulus
140 GPa 20 x 106 psi
Flexural Strength
130 MPa 18 x 103 psi
Fracture Toughness
3.1 MPa-m1/2 2.9 x 103 psi-in1/2
Poisson's Ratio
0.24
Tensile Strength: Ultimate (UTS)
230 MPa 33 x 103 psi
Electrical Properties
Dielectric Constant (Relative Permittivity) At 1 MHz
10
Dielectric Strength (Breakdown Potential)
18 kV/mm 0.7 V/mil
Electrical Dissipation At 1 Hz
0.0019
Electrical Dissipation At 1 MHz
0.0017
Electrical Resistivity Order of Magnitude
11 10x Ω-m
Other Material Properties
Density
2.2 g/cm3 140 lb/ft3
Maximum Temperature: Mechanical
1210 °C 2210 °F
Maximum Thermal Shock
420 °C 790 °F
Specific Heat Capacity
730 J/kg-K 0.17 BTU/lb-°F
Thermal Conductivity
12 W/m-K 7.0 BTU/h-ft-°F
Thermal Expansion
2.6 µm/m-K
Common Calculations
Stiffness to Weight: Axial
34 points
Stiffness to Weight: Bending
78 points
Strength to Weight: Axial
29 points
Strength to Weight: Bending
37 points
Thermal Diffusivity
7.5 mm2/s
Thermal Shock Resistance
46 points
Followup Questions
Further Reading
Silicon Nitride and the Sialons, Vivien Mitchell, 1993
Handbook of Refractory Carbides and Nitrides: Properties, Characteristics, Processing and Applications, Hugh O. Pierson, 1996
IEC 60672-3: Ceramic and glass-insulating materials - Part 3: Specifications for individual materials
Springer Handbook of Condensed Matter and Materials Data, W. Martienssen and H. Warlimont (editors), 2005
Sintering of Advanced Materials: Fundamentals and Processes, Zhigang Zak Fang (editor), 2010