Soft Annealed (O60) C18900 Copper
O60 C18900 copper is C18900 copper in the O60 (soft annealed) temper. The graph bars on the material properties cards below compare O60 C18900 copper to: wrought coppers (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Elastic (Young's, Tensile) Modulus
120 GPa 17 x 106 psi
Elongation at Break
48 %
Poisson's Ratio
0.34
Shear Modulus
43 GPa 6.2 x 106 psi
Shear Strength
190 MPa 27 x 103 psi
Tensile Strength: Ultimate (UTS)
260 MPa 38 x 103 psi
Tensile Strength: Yield (Proof)
67 MPa 9.8 x 103 psi
Thermal Properties
Latent Heat of Fusion
210 J/g
Maximum Temperature: Mechanical
200 °C 390 °F
Melting Completion (Liquidus)
1080 °C 1970 °F
Melting Onset (Solidus)
1020 °C 1860 °F
Specific Heat Capacity
390 J/kg-K 0.092 BTU/lb-°F
Thermal Conductivity
130 W/m-K 75 BTU/h-ft-°F
Thermal Expansion
17 µm/m-K
Electrical Properties
Electrical Conductivity: Equal Volume
30 % IACS
Electrical Conductivity: Equal Weight (Specific)
30 % IACS
Otherwise Unclassified Properties
Base Metal Price
31 % relative
Density
8.9 g/cm3 560 lb/ft3
Embodied Carbon
2.7 kg CO2/kg material
Embodied Energy
42 MJ/kg 18 x 103 BTU/lb
Embodied Water
310 L/kg 37 gal/lb
Common Calculations
Resilience: Ultimate (Unit Rupture Work)
95 MJ/m3
Resilience: Unit (Modulus of Resilience)
20 kJ/m3
Stiffness to Weight: Axial
7.2 points
Stiffness to Weight: Bending
18 points
Strength to Weight: Axial
8.2 points
Strength to Weight: Bending
10 points
Thermal Diffusivity
38 mm2/s
Thermal Shock Resistance
9.3 points
Alloy Composition
Cu | 97.7 to 99.15 | |
Sn | 0.6 to 0.9 | |
Si | 0.15 to 0.4 | |
Mn | 0.1 to 0.3 | |
Zn | 0 to 0.1 | |
P | 0 to 0.050 | |
Pb | 0 to 0.020 | |
Al | 0 to 0.010 | |
res. | 0 to 0.5 |
All values are % weight. Ranges represent what is permitted under applicable standards.
Followup Questions
Further Reading
CRC Materials Science and Engineering Handbook, 4th ed., James F. Shackelford et al. (editors), 2015