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M30 C11400 Copper vs. M30 C49300 Brass

Both M30 C11400 copper and M30 C49300 brass are copper alloys. Both are furnished in the M30 (as hot extruded) condition. They have 60% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is M30 C11400 copper and the bottom bar is M30 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
100
Elongation at Break, % 50
20
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
40
Shear Strength, MPa 150
270
Tensile Strength: Ultimate (UTS), MPa 220
430
Tensile Strength: Yield (Proof), MPa 75
210

Thermal Properties

Latent Heat of Fusion, J/g 210
170
Maximum Temperature: Mechanical, °C 200
120
Melting Completion (Liquidus), °C 1080
880
Melting Onset (Solidus), °C 1030
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 390
88
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
15
Electrical Conductivity: Equal Weight (Specific), % IACS 100
17

Otherwise Unclassified Properties

Base Metal Price, % relative 32
26
Density, g/cm3 9.0
8.0
Embodied Carbon, kg CO2/kg material 2.6
3.0
Embodied Energy, MJ/kg 42
50
Embodied Water, L/kg 350
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 86
71
Resilience: Unit (Modulus of Resilience), kJ/m3 24
220
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8
15
Strength to Weight: Bending, points 9.1
16
Thermal Diffusivity, mm2/s 110
29
Thermal Shock Resistance, points 7.8
14

Alloy Composition

Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0
0.5 to 2.0
Copper (Cu), % 99.84 to 99.966
58 to 62
Iron (Fe), % 0
0 to 0.1
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Silver (Ag), % 0.034 to 0.060
0
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 0
30.6 to 40.5
Residuals, % 0
0 to 0.5