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EN 2.4669 Nickel vs. C11600 Copper

EN 2.4669 nickel belongs to the nickel alloys classification, while C11600 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is EN 2.4669 nickel and the bottom bar is C11600 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 16
2.7 to 50
Poisson's Ratio 0.29
0.34
Shear Modulus, GPa 73
43
Shear Strength, MPa 680
160 to 240
Tensile Strength: Ultimate (UTS), MPa 1110
230 to 410
Tensile Strength: Yield (Proof), MPa 720
77 to 410

Thermal Properties

Latent Heat of Fusion, J/g 310
210
Maximum Temperature: Mechanical, °C 960
200
Melting Completion (Liquidus), °C 1380
1080
Melting Onset (Solidus), °C 1330
1030
Specific Heat Capacity, J/kg-K 460
390
Thermal Conductivity, W/m-K 12
390
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.4
100
Electrical Conductivity: Equal Weight (Specific), % IACS 1.5
100

Otherwise Unclassified Properties

Base Metal Price, % relative 60
35
Density, g/cm3 8.4
9.0
Embodied Carbon, kg CO2/kg material 10
2.7
Embodied Energy, MJ/kg 150
42
Embodied Water, L/kg 260
390

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 160
9.7 to 91
Resilience: Unit (Modulus of Resilience), kJ/m3 1380
25 to 710
Stiffness to Weight: Axial, points 13
7.2
Stiffness to Weight: Bending, points 23
18
Strength to Weight: Axial, points 37
7.2 to 13
Strength to Weight: Bending, points 28
9.4 to 14
Thermal Diffusivity, mm2/s 3.1
110
Thermal Shock Resistance, points 33
8.2 to 15

Alloy Composition

Aluminum (Al), % 0.4 to 1.0
0
Carbon (C), % 0 to 0.080
0
Chromium (Cr), % 14 to 17
0
Cobalt (Co), % 0 to 1.0
0
Copper (Cu), % 0 to 0.5
99.78 to 99.915
Iron (Fe), % 5.0 to 9.0
0
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 65.9 to 77.7
0
Niobium (Nb), % 0.7 to 1.2
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0.085 to 0.12
Sulfur (S), % 0 to 0.015
0
Titanium (Ti), % 2.3 to 2.8
0
Residuals, % 0
0 to 0.1