Solder Alloy 101 vs. C34500 Brass
Solder alloy 101 belongs to the otherwise unclassified metals classification, while C34500 brass belongs to the copper alloys. There are 26 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.
For each property being compared, the top bar is solder alloy 101 and the bottom bar is C34500 brass.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 38 | |
| 100 |
| Elongation at Break, % | 48 | |
| 12 to 28 |
| Poisson's Ratio | 0.39 | |
| 0.31 |
| Shear Modulus, GPa | 14 | |
| 40 |
| Tensile Strength: Ultimate (UTS), MPa | 31 | |
| 340 to 430 |
| Tensile Strength: Yield (Proof), MPa | 27 | |
| 120 to 180 |
Thermal Properties
| Latent Heat of Fusion, J/g | 46 | |
| 170 |
| Melting Completion (Liquidus), °C | 180 | |
| 910 |
| Melting Onset (Solidus), °C | 180 | |
| 890 |
| Specific Heat Capacity, J/kg-K | 190 | |
| 380 |
| Thermal Conductivity, W/m-K | 51 | |
| 120 |
| Thermal Expansion, µm/m-K | 25 | |
| 21 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 12 | |
| 26 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 12 | |
| 29 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.8 | |
| 8.2 |
| Embodied Carbon, kg CO2/kg material | 11 | |
| 2.6 |
| Embodied Energy, MJ/kg | 180 | |
| 45 |
| Embodied Water, L/kg | 930 | |
| 320 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 14 | |
| 42 to 75 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 9.9 | |
| 69 to 160 |
| Stiffness to Weight: Axial, points | 2.4 | |
| 7.1 |
| Stiffness to Weight: Bending, points | 13 | |
| 19 |
| Strength to Weight: Axial, points | 1.0 | |
| 12 to 15 |
| Strength to Weight: Bending, points | 2.5 | |
| 13 to 16 |
| Thermal Diffusivity, mm2/s | 31 | |
| 37 |
| Thermal Shock Resistance, points | 2.4 | |
| 11 to 14 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.2 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.080 | |
| 62 to 65 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.15 |
| Lead (Pb), % | 35.8 to 37.5 | |
| 1.5 to 2.5 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 62.5 to 63.5 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 32 to 36.5 |
| Residuals, % | 0 | |
| 0 to 0.4 |