Solder Alloy 101 vs. C81500 Copper
Solder alloy 101 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 27 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.
For each property being compared, the top bar is solder alloy 101 and the bottom bar is C81500 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Brinell Hardness | 14 | |
| 110 |
| Elastic (Young's, Tensile) Modulus, GPa | 38 | |
| 120 |
| Elongation at Break, % | 48 | |
| 17 |
| Poisson's Ratio | 0.39 | |
| 0.34 |
| Shear Modulus, GPa | 14 | |
| 44 |
| Tensile Strength: Ultimate (UTS), MPa | 31 | |
| 350 |
| Tensile Strength: Yield (Proof), MPa | 27 | |
| 280 |
Thermal Properties
| Latent Heat of Fusion, J/g | 46 | |
| 210 |
| Melting Completion (Liquidus), °C | 180 | |
| 1090 |
| Melting Onset (Solidus), °C | 180 | |
| 1080 |
| Specific Heat Capacity, J/kg-K | 190 | |
| 390 |
| Thermal Conductivity, W/m-K | 51 | |
| 320 |
| Thermal Expansion, µm/m-K | 25 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 12 | |
| 82 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 12 | |
| 83 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.8 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 11 | |
| 2.6 |
| Embodied Energy, MJ/kg | 180 | |
| 41 |
| Embodied Water, L/kg | 930 | |
| 310 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 14 | |
| 56 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 9.9 | |
| 330 |
| Stiffness to Weight: Axial, points | 2.4 | |
| 7.3 |
| Stiffness to Weight: Bending, points | 13 | |
| 18 |
| Strength to Weight: Axial, points | 1.0 | |
| 11 |
| Strength to Weight: Bending, points | 2.5 | |
| 12 |
| Thermal Diffusivity, mm2/s | 31 | |
| 91 |
| Thermal Shock Resistance, points | 2.4 | |
| 12 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.1 |
| Antimony (Sb), % | 0 to 0.2 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Chromium (Cr), % | 0 | |
| 0.4 to 1.5 |
| Copper (Cu), % | 0 to 0.080 | |
| 97.4 to 99.6 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.1 |
| Lead (Pb), % | 35.8 to 37.5 | |
| 0 to 0.020 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 |
| Silicon (Si), % | 0 | |
| 0 to 0.15 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 62.5 to 63.5 | |
| 0 to 0.1 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 to 0.1 |
| Residuals, % | 0 | |
| 0 to 0.5 |