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Solder Alloy 133 vs. C17300 Copper

Solder alloy 133 belongs to the otherwise unclassified metals classification, while C17300 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 133 and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 33
120
Elongation at Break, % 34
3.0 to 23
Poisson's Ratio 0.4
0.33
Shear Modulus, GPa 12
45
Tensile Strength: Ultimate (UTS), MPa 41
500 to 1380

Thermal Properties

Latent Heat of Fusion, J/g 42
230
Melting Completion (Liquidus), °C 220
980
Melting Onset (Solidus), °C 180
870
Specific Heat Capacity, J/kg-K 180
380
Thermal Conductivity, W/m-K 47
110
Thermal Expansion, µm/m-K 25
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
22
Electrical Conductivity: Equal Weight (Specific), % IACS 10
23

Otherwise Unclassified Properties

Density, g/cm3 9.3
8.8
Embodied Carbon, kg CO2/kg material 9.4
9.4
Embodied Energy, MJ/kg 160
150
Embodied Water, L/kg 840
310

Common Calculations

Stiffness to Weight: Axial, points 2.0
7.6
Stiffness to Weight: Bending, points 12
19
Strength to Weight: Axial, points 1.2
16 to 44
Strength to Weight: Bending, points 2.9
16 to 31
Thermal Diffusivity, mm2/s 29
32
Thermal Shock Resistance, points 3.5
17 to 48

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.2
Antimony (Sb), % 0.2 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
1.8 to 2.0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
95.5 to 97.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 48.5 to 50.3
0.2 to 0.6
Nickel (Ni), % 0 to 0.010
0.2 to 0.6
Silicon (Si), % 0
0 to 0.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 49.5 to 50.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.5