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Solder Alloy 502 vs. ASTM B628 Ag-Cu

Both solder alloy 502 and ASTM B628 Ag-Cu are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 502 and the bottom bar is ASTM B628 Ag-Cu.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
83
Elongation at Break, % 34
1.1 to 17
Poisson's Ratio 0.36
0.36
Shear Modulus, GPa 19
31
Tensile Strength: Ultimate (UTS), MPa 58
350 to 760

Thermal Properties

Latent Heat of Fusion, J/g 66
140
Melting Completion (Liquidus), °C 350
780
Melting Onset (Solidus), °C 220
780
Specific Heat Capacity, J/kg-K 230
280
Thermal Expansion, µm/m-K 22
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
84
Electrical Conductivity: Equal Weight (Specific), % IACS 15
75

Otherwise Unclassified Properties

Density, g/cm3 7.4
10

Common Calculations

Stiffness to Weight: Axial, points 4.0
4.6
Stiffness to Weight: Bending, points 17
14
Strength to Weight: Axial, points 2.2
9.5 to 21
Strength to Weight: Bending, points 4.5
11 to 18
Thermal Shock Resistance, points 3.6
16 to 34

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0050
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0 to 0.050
Copper (Cu), % 3.5 to 4.5
26.6 to 29
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.050
Lead (Pb), % 0 to 0.070
0 to 0.030
Nickel (Ni), % 0 to 0.010
0 to 0.010
Phosphorus (P), % 0
0 to 0.030
Silver (Ag), % 0.8 to 1.2
71 to 73
Tin (Sn), % 93.8 to 95.7
0
Zinc (Zn), % 0 to 0.0010
0 to 0.060
Residuals, % 0
0 to 0.21