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Solder Alloy 502 vs. Solder Alloy 402

Both solder alloy 502 and solder alloy 402 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a very high 98% of their average alloy composition in common. There are 22 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is solder alloy 502 and the bottom bar is solder alloy 402.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
52
Elongation at Break, % 34
20
Poisson's Ratio 0.36
0.36
Shear Modulus, GPa 19
19
Tensile Strength: Ultimate (UTS), MPa 58
57

Thermal Properties

Latent Heat of Fusion, J/g 66
64
Melting Completion (Liquidus), °C 350
310
Melting Onset (Solidus), °C 220
230
Specific Heat Capacity, J/kg-K 230
230
Thermal Conductivity, W/m-K 47
61
Thermal Expansion, µm/m-K 22
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
15
Electrical Conductivity: Equal Weight (Specific), % IACS 15
18

Otherwise Unclassified Properties

Density, g/cm3 7.4
7.3
Embodied Carbon, kg CO2/kg material 15
15
Embodied Energy, MJ/kg 260
250

Common Calculations

Stiffness to Weight: Axial, points 4.0
3.9
Stiffness to Weight: Bending, points 17
17
Strength to Weight: Axial, points 2.2
2.2
Strength to Weight: Bending, points 4.5
4.5
Thermal Diffusivity, mm2/s 28
37
Thermal Shock Resistance, points 3.6
3.6

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.080
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 3.5 to 4.5
2.5 to 3.5
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0.8 to 1.2
0 to 0.1
Tin (Sn), % 93.8 to 95.7
95.9 to 97.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010