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Solder Alloy 502 vs. C77300 Nickel Silver

Solder alloy 502 belongs to the otherwise unclassified metals classification, while C77300 nickel silver belongs to the copper alloys. There are 19 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 502 and the bottom bar is C77300 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Poisson's Ratio 0.36
0.3
Shear Modulus, GPa 19
42
Tensile Strength: Ultimate (UTS), MPa 58
540

Thermal Properties

Latent Heat of Fusion, J/g 66
180
Melting Completion (Liquidus), °C 350
940
Melting Onset (Solidus), °C 220
920
Specific Heat Capacity, J/kg-K 230
390
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 15
6.3

Otherwise Unclassified Properties

Density, g/cm3 7.4
7.9
Embodied Carbon, kg CO2/kg material 15
3.5
Embodied Energy, MJ/kg 260
56

Common Calculations

Stiffness to Weight: Axial, points 4.0
7.7
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.2
19
Strength to Weight: Bending, points 4.5
19
Thermal Shock Resistance, points 3.6
17

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 3.5 to 4.5
46 to 50
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.050
Nickel (Ni), % 0 to 0.010
9.0 to 11
Phosphorus (P), % 0
0 to 0.25
Silicon (Si), % 0
0.040 to 0.25
Silver (Ag), % 0.8 to 1.2
0
Tin (Sn), % 93.8 to 95.7
0
Zinc (Zn), % 0 to 0.0010
37.9 to 45
Residuals, % 0
0 to 0.5