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Solder Alloy 704 vs. C12500 Copper

Solder alloy 704 belongs to the otherwise unclassified metals classification, while C12500 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 30
1.5 to 50
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 55
220 to 420

Thermal Properties

Latent Heat of Fusion, J/g 62
210
Melting Completion (Liquidus), °C 240
1080
Melting Onset (Solidus), °C 220
1070
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 50
350
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
92
Electrical Conductivity: Equal Weight (Specific), % IACS 15
93

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 19
2.6
Embodied Energy, MJ/kg 320
41

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.9 to 13
Strength to Weight: Bending, points 4.3
9.1 to 14
Thermal Diffusivity, mm2/s 30
100
Thermal Shock Resistance, points 3.5
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0 to 0.0030
Arsenic (As), % 0 to 0.030
0 to 0.012
Bismuth (Bi), % 0 to 0.1
0 to 0.0030
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.88 to 100
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.0040
Nickel (Ni), % 0 to 0.010
0 to 0.050
Silver (Ag), % 4.8 to 5.2
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 94.3 to 95.2
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.3