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Solder Alloy 801 vs. C12500 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C12500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
1.5 to 50
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
220 to 420

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1080
Melting Onset (Solidus), °C 200
1070
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
350
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
92
Electrical Conductivity: Equal Weight (Specific), % IACS 19
93

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
2.6
Embodied Energy, MJ/kg 240
41
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.9 to 13
Strength to Weight: Bending, points 4.4
9.1 to 14
Thermal Diffusivity, mm2/s 36
100
Thermal Shock Resistance, points 3.3
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0 to 0.0030
Arsenic (As), % 0 to 0.030
0 to 0.012
Bismuth (Bi), % 0 to 0.1
0 to 0.0030
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.88 to 100
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.0040
Nickel (Ni), % 0 to 0.010
0 to 0.050
Silver (Ag), % 0 to 0.1
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.3