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Solder Alloy 811 vs. C12500 Copper

Solder alloy 811 belongs to the otherwise unclassified metals classification, while C12500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
120
Elongation at Break, % 38
1.5 to 50
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 53
220 to 420

Thermal Properties

Latent Heat of Fusion, J/g 63
210
Melting Completion (Liquidus), °C 200
1080
Melting Onset (Solidus), °C 190
1070
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 59
350
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
92
Electrical Conductivity: Equal Weight (Specific), % IACS 17
93

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 14
2.6
Embodied Energy, MJ/kg 240
41
Embodied Water, L/kg 1200
310

Common Calculations

Stiffness to Weight: Axial, points 4.0
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.0
6.9 to 13
Strength to Weight: Bending, points 4.3
9.1 to 14
Thermal Diffusivity, mm2/s 35
100
Thermal Shock Resistance, points 3.3
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0 to 0.0030
Arsenic (As), % 0 to 0.030
0 to 0.012
Bismuth (Bi), % 2.8 to 3.2
0 to 0.0030
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.88 to 100
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.0040
Nickel (Ni), % 0 to 0.010
0 to 0.050
Silver (Ag), % 0 to 0.1
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
0
Residuals, % 0
0 to 0.3